Semiconductors - Zero-width Glass Separation (eCO2)
Growth of the Flat Panel Display market (TFT and PDP) in its volume and the size of the panels required has highlighted the advantages of using lasers for the separation of the glass sheets into final panel sizes.
The glass separation uses a special technique where no glass material is removed, as in a cutting operation, but rather stresses are built up in the glass by the interaction of the laser beam, leading to a controlled clean break propagating across the glass. This break is so clean that if the glass sections are not moved apart they would fuse back together over time.
This operation produces no debris to contaminate the panels, and gives smooth edges to the cut with no micro-cracking. The panels are then much more robust in resisting breaking during further manufacturing operations and handling.
The laser characteristics needed are careful control of the laser mode quality and power output to give consistent separation results.
In the high volume manufacturing environment the laser needs to have minimal maintenance requirements and high reliability leading to high up-time.
The GSI Group eCO2 range of sealed off DC excited CO2 lasers fulfill these requirements, and have the added benefit of ease of integration into systems designed for next generation FPD processes.
The DC excited CO2 lasers have a high efficiency making them economical to operate. As they can run off a single phase electrical supply, and put have a low heat load, thus minimizing the cooling capacity needed, they can easily be installed into an existing factory infrastructure altogether making them an ideal choice for this application.
Typical lasers that have been used for this application
eCO2 SLC Series
DC-Excited CO2, 65 - 220W at 10.6µm TEMoo
Please call us to discuss lasers for your specific application
Click here for expert advice on Semiconductor applications.